Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today announced the expansion of its full thermal management portfolio with the availability of Vertiv CoolChip CDU 2300 and Vertiv CoolChip Fluid Network Row Manifolds in Europe, the Middle East, and Africa (EMEA). These liquid cooling technologies address the growing demands of artificial intelligence and next-generation, high-density compute infrastructures, helping customers deploy high-density infrastructures faster and operate more efficiently.
The Vertiv CoolChip family is an essential component of the Vertiv thermal chain—an end-to-end portfolio integrating direct-to-chip cooling, immersion cooling, rear-door heat exchangers, coolant distribution, heat dissipation, intelligent control systems, and lifecycle services into a unified and coherent thermal management system.
The new solutions announced will be showcased at the Datacloud Global Congress in Cannes (June 1–4), where Vertiv will participate as a Patron Sponsor and present its latest technologies at booth #123.
„The accelerated growth of AI workloads is driving a fundamental transformation in how data centers are designed, cooled, powered, and operated, said Paul Ryan, Vertiv’s president for the EMEA region. At Datacloud Global Congress, we are demonstrating how Vertiv is expanding its end-to-end portfolio, combining power solutions for high-density environments, liquid cooling, heat dissipation, intelligent control systems, and lifecycle services to help customers deploy AI-ready infrastructure faster and operate it more efficiently long-term.”
As an essential link in the Vertiv thermal chain, the Vertiv CoolChip CDU 2300 is a liquid-to-liquid cooling distribution unit, delivering 2.3 MW of cooling capacity in a compact footprint, offering one of the best capacity-to-footprint ratios available on the market. The small cabinet size allows for flexible placement, including between racks or in adjacent mechanical areas, helping operators reduce rack space and the number of CDUs required in large-scale high-density deployments.
Vertiv CoolChip CDU systems cover a range from 100 kW to 2.3 MW and support both direct-to-chip cooling and rear-door heat exchangers. The integrated Vertiv CoolChip CDU controller allows for temperature and flow rate adaptation based on load requirements, while features such as redundancy, inter-unit communication, and remote monitoring contribute to increased system availability and simplified operations. Integrated intelligence at the controller level allows the CDU to operate in coordination with other thermal chain components, ensuring consistent thermal performance across the entire infrastructure.
Completing the thermal chain architecture alongside the CDU, the new Vertiv CoolChip Fluid Network Row Manifolds provide the physical connectivity layer between the cooling distribution units, server-level cooling equipment, and heat dissipation systems. Each fluid manifold assembly is cleaned, passivated, pressure tested, and sealed to deliver a superior level of cleanliness, corrosion resistance, and leak-free performance. The configurable design ensures full compatibility with direct-to-chip, immersion cooling, and rear-door heat exchanger systems, while simplifying cooling circuit routing. The solution also enables rapid deployments for both new builds and retrofits, helping operators scale liquid cooling infrastructures in weeks, not months.
Vertiv is complementing its portfolio with Vertiv Liquid Cooling Services, which include design support, installation, and ongoing maintenance. This full lifecycle approach is designed to help customers maximize efficiency, maintain system availability, and ensure consistent performance as liquid cooling becomes an essential component of modern data center operations.